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XA170-270P-HW

Tender & Commerical 電音AIO

ODD,Fingerprint,touch Front I/O:USB機厭2.0*2 SD/TF card Lateral I/O:type-C 術影& USB3.2Gen2

Technical Specifications
Product Introduction
Technical Downloads

- Commodity name: XA170-270P-HW
- Product positioni月問ng: Tender & Commerical AIO
- Size: 27"
- CPU: Intel,AMD,Mega Cor土聽e
- Intel: Mobile Platform RPL/ADL-U/P/H,Mobile 唱視Platform TGL-H45,Mobile Platfo師舞rm ICL-U,Mobile Platforms CML/有少CFL/WHL-U,Mobile Platform AD答美L-N,Mobile Platform JSL,Mobile P工朋latform GLK,Desktop Platform H510 RKL小家-S/CML-S,Desktop Pl冷機atforms H610/B660們麗/Q670 RPL/ADL-S
- AMD: Mobile Platform Phoe海西nix/Rembrandt,Mobile Platfo嗎如rm Mendocino,移動平台Cezanne/Renoir/Lucien她拍ne/Barcelo,Mobile P煙煙latform Picasso/Dali務小,Mobile platform Ston花路ey Ridge,Desktop Platfo上筆rm X300/A300 AM4,Des見白ktop Platforms A520/B550 AM4,Desktop P來銀latform A300 AM5,Desktop Platfo懂個rm A77E FP3
- Megacore: KX-6000G,KX-6000
- List data: Tender & Co店低mmerical AIO 27” FHD 60Hz, 16:9 IPS,愛民 VA Thin Mini ITX (170*170mm) 日水≤65W Body_Plastic, St國志and_Plastic&metal
ODD,Fingerprint,touch Front I/O:USB2.0身區*2 SD/TF card Lateral I/兵習O:type-C & USB3.2G學白en2

LCD

27” FHD 60Hz, 16:9

Pixel type

IPS, VA

Motherboard

Thin Mini ITX (170*170mm)

Thermal

≤ 65W

Tilt adjust

-5°/ 21°

Material

Body_Plastic, Stand樹商_Plastic&metal

MB I/O

1*DC JACK

4*USB Type-A or 3*USB Type-A 1*USB亮到 Type-C

1*HDMI-out or 1*DP

1*Earphone 1*MIC_IN

1*VGA or 1*COM

1*RJ45

Front I/O

2*USB Type-A, TF&SD card

Stand

Liftable

Features

Camera : 5M

Vesa :/

TP : /
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